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Hon. William C. Conner Writing Competition

Award Amount
$2,500
Award Amount
Application deadline
April 30, 2025
Application deadline
Awarded By:

New York Intellectual Property Law Association (NYIPLA)

Number of Awards & Eligibility: Two awards will be provided annually.
In order to qualify, students must meet the following criteria:
  1. Must be currently enrolled in a law school in the United States.

In order to qualify, students must meet the following criteria:

Description: The Hon. William C. Conner Writing Competition is available for current law school students in the United States. Applicants must submit a legal paper on the topic of intellectual property.

Application requirements for the Hon. William C. Conner Writing Competition are:

  • Application form
  • Essay
Additional Information: The Hon. William C. Conner Writing Competition is provided annually by the New York Intellectual Property Law Association (NYIPLA) and awards multiple scholarships to current law school students who submit excellent papers on the topic of intellectual property. Papers will be judged based on professionalism, topic relevance, organization, quality of legal analysis, and overall strength of writing.

Award Amount: $1,500 for the first place applicant and $1,000 for the runner-up. Awards are provided on a one-time basis and are non-renewable.  The total dollars awarded for this scholarship is $2,500.

About New York Intellectual Property Law Association (NYIPLA):
Contact Information: Richard H. Brown
Address: Day Pitney LLP 7 Times Square New York, New York 10036-7311
Email: rbrown@daypitney.com
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